Offering inspection speeds of up to 180 cm2/sec, the TR7007 SII is the fastest solder paste inspection system in the industry. This highly accurate inline shadow-free solder paste inspection solution offers full 3D inspection at resolutions of 15 µm or 10 µm. Built on a high precision linear motor platform, the system’s hallmark features include closed loop function, enhanced 2D imaging, auto-warp compensation and fringe pattern technology. Increase capacity without sacrificing additional space with an available dual-lane configuration.
Optical System
|
Imaging Method |
Dynamic Imaging |
|
Camera |
4 Mpix |
|
Imaging Resolution |
10 µm or 15 µm (factory setting) |
|
Lighting |
RGB LED |
|
3D Technology |
2-way Fringe Pattern |
|
Field of View |
4 Mpix@ 10 µm: 20 x 20 mm
4 Mpix@ 15 µm: 30 x 30 mm |
Inspection Performance
|
Imaging Speed |
4 Mpix@ 10 µm: 80 cm²/sec
4 Mpix@ 15 µm: 180 cm²/sec |
|
Height Resolution |
0.4 µm |
|
Max. Solder Height |
@ 10 µm: 600 µm
@ 15 µm: 550 µm |
Motion Table & Control
|
X-Axis Control |
Linear Motor and linear scale with DSP-based controller |
|
Y-Axis Control |
Ballscrew + AC-servo controller |
|
Z-Axis Control |
Ballscrew + AC-servo controller |
|
X-Y Axis Resolution |
0.5 µm |
|
Z-Axis Resolution |
1 µm |
Board Handling
|
Max PCB Size |
TR7007 SII: 510 x 460 mm
TR7007LL SII: 850 x 610 mm |
|
PCB Thickness |
0.6-5 mm |
|
Max PCB Weight |
TR7007 SII: 3 kg
TR7007LL SII: 5 kg |
|
Top Clearance |
40 mm |
|
Bottom Clearance |
40 mm |
|
Edge Clearance |
3 mm |
|
Conveyor Height |
880 – 920 mm
* SMEMA Compatible |
Inspection Functions
|
Defects |
Insufficient Paste
Excessive Paste
Shape Deformity
Missing Paste & Bridging |
|
Measurement |
Height
Area
Volume
Offset |
Dimensions
|
WxDxH |
TR7007 SII: 1220 x 1663 x 1620
TR7007LL SII: 1600 x 1813 x 1637 mm
Note: not including signal tower, signal tower height 520 mm |
|
Weight |
TR7007 SII: 920 kg
TR7007LL SII: 1117 kg |
