Inspection Principle: Programmable phase contour modulation measurement techniques(PSLM PMP)
Inspection type:Volume, area, height, XY offset, shape, etc.
Defect Types:shift, excessive solder, insufficient solder, offset, deformed shape
D-lighting patented technology.
Dynamic copying function and static anti-warping function.
Barcode function with traceability .
Badmark function with mounters.
Closed loop function with printer
Access MES system functions.
Operating System Support: Windows 7 Professional (64 bit).
Five-minute programming, one-click operation.
RGB Tune patented technology.
SinicTek 3D SPI InSPIre-510C
Smallest component size: 008004.
XY positioning accuracy：1um Grating ruler.
Repeatability: height：≤1um （4 Sigma）;volume/acreage：<1%（4 Sigma）.
Maximum Loading PCB Size(X*Y): 450x450mm.
Inspection Speed: 0.3 SEC/FOV.
Fiducial mark Detection Time: 0.5sec/piece.
Maximum inspection component height:±550um （±1200umOption）.
High precision industrial camera with high frame count.
