Flux Free Formic Reflow
REFLOW IN FORMIC ACID VAPOR
Heller has designed and built an production ready horizontal reflow oven for formic acid vapor. This new oven has been designed to meet Semi S2/S8 safety standards (including toxic gases).
Formic Acid has been shown to be an effective reducing agent in fluxless solder reflow
Excellent results demonstrated for wafer bumping application in horizontal reflow oven
Fluxless reflow utilizes gas phase Formic Acid (HCOOH) to replace standard fluxing agents
Eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps
No post-reflow flux clean facilitates inline application of epoxy and inline epoxy curing solution
Feasibility has been demonstrated with production grade oven
Extensive engineering efforts in safe, precision delivery of formic acid and abatement
Fluxless Reflow Advantages
Can use any reflow profile (e.g., tent or soak profile) with formic acid
Can adjust formic acid profile in oven in conjunction with thermal reflow profile
Includes Formic acid safety system (i.e., sensors/detectors) adheres to industry standards
Includes Formic acid abatement systems for Green Process Solution
Includes real time formic acid concentration monitor system
