High end selective soldering system to integrate into in-line manufacturing concepts
Mini-wave soldering for high flexibility or multi-wave soldering (in preparation) for high volume applications
Product change without loss in production time with the multi-wave process (in preparation)
Processable area 20″ x 20″
Soldering module Y/Z variable
Versacam for height measurement on the fly
Versaflex soldering module X/Y/Z variable
Power convection for optimal homogenous preheats
Parallel process through separation of fluxing, preheating and soldering cycle
Use of up to 4 flux spray heads
Fluxer y-variable
Flexible system configuration on account of modularity of the design
Ideal for linking to manual workstations or peripheral equipment
Secure process control with monitoring of all relevant processes
CAD-Assistant for offline programming
Link for traceability systems for process control
VERSAFLOW 4/55
The worlds leading inline selective soldering system VERSAFLOW meets the highest demands in flexibility and throughput. With almost endless possibilities of configurations the system is ideal to meet any customer requirement.
The additional modules of the VERSAFLOW make it fit for future demands. The Ersa VERSAFLOW 4/55 ist the 4th generation of the leading inline selective soldering system and inspires with its new user interface and increased process flexibility
Dimensions
Length from 2,600 mm
Width approx. 1,700 mm
Height approx. 1,600 mm
Conveyor support
Roller conveyor
PCB width: 63.5-508 mm
PCB length: 127-508 mm
Maximum PCB top side clearance: 120 mm
Maximumg PCB bottom side clearance: 30 mm
Maximum PCB weight: 5 kg (option 15 kg)
Media supply
Nitrogen
Pneumatic system
Electric supply
Extracted air
Flux module
Drop-Jet in different sizes
Preheat module
IR heating, convection or combination of IR and convection
Solder module
Electromagnetic solder pot
Mini-wave 13 kg up to 6 pots
Options:
Roller-type conveyor for direct board handling
Programmable width adjustment
Precision Drop-Jet Fluxer, up to 2 X-Y modules and 4 spray heads per module
Maximum permissible board weight: 15 kg
2 different flux media for each module
Up to 5 preheat modules
IR preheater individually configurable, convection on lower and upper side
Pyrometer to monitor temperature
Up to 3 solder modules with each 2 solder bath for mini-wave and mini-dip applications
Electromagnetic multi-dip-bath, modular construction (in preparation)
Tool-change on the fly for multi-dip tools (in preparation)
Controlled rest-oxygen value in multi-dip tool (in preparation)
Combination of multi-wave bath and mini-wave modules (in preparation)
Transfer of board data from the CAD system
ERSASOFT 5 incl. integration of MES (Manufacturing Execution System)
