Compact Selective Soldering System with small footprint
Batch or in-line operation
Ersa CAD Software
Up to 2 solder bath and 2 fluxer heads to increase throughput
Use of mini-wave nozzles, mini-dip nozzles and area-soldering nozzles possible
Maintenance free electromagnetic solder pump drive
Drop-jet fluxer with integrated monitoring
High positioning accuracy and process safety
Lower, full-area IR preheater (scalable)
Convection top side
Low energy and N2 consumption
Selective Soldering Machine Ersa ECOSELECT 2
Flexible solution for modular manufacturing concepts
Ersa, the worldwide technology leader in selective soldering systems, complements with the ECOSELECT 2 the successful VERSAFLOW line of systems with a compact selective soldering unit. This system is the optimal solution for processing small to medium production runs, where flexibility is of prime importance. The intelligent and clearly laid out user software, which also records all relevant production parameters, allows for simple and effective programming of the system. One highlight is offered by the graphical programming interface vie the CAD Assistant 2 – this new software version makes offline programming, with the system in continuing operation, easily and very quickly possible.
Programmable precision spray fluxer for flux deposition
DFX data scanned-in printed circuit boards can be used for programming. The user administration function rules out the unauthorized use of the system. Like all Ersa selective soldering systems, the ECOSELECT 2 features a programmable precision spray fluxer with integrated spray jet monitoring to deposit flux either in points or in tracks. The extremely precise flux deposition ensures minimal flux use and offers therefore the highest level of cleanliness of the assemblies. Short-wave IR emitters on the underside of the board speed up the preheat process. Individual segments of the heater cassette can be, based on the product, switched off. With the optional upper convection preheater, a homogeneous soak of even the most complex assemblies can be ensured.
At the heart of the system is the solder process itself: The "peel off" effect developed by Ersa for soldering at a 0° angle eliminates the risk of bridging and ensures achieving the lowest DPM rate. The solder bath requires very little service and is free of wear parts. Innovative monitoring systems ensure the reproducibility of the process parameters. The new inn- and offline concept of the ECEOSELECT 2 offers the quality of the selective soldering process at the best price/performance ratio. Thus it is, both for, users new to the process as well as for those producing in series, the perfect and flexible solution.
Dimensions
Length from 2,300 mm
Width approx. 1,730 mm
Height approx. 1,650 mm
Conveyor system
Pin-and-chain conveyor
PCB width: 63.5-508 mm
PCB length: 127-508 mm
Maximum PCB top side clearance: 120 mm
Maximumg PCB bottom side clearance: 60 mm (30 mm upto z – variable)
Maximum PCB weight: 8 kg (option 12 kg)
Media supply
Nitrogen
Pneumatic system
Electric supply
Extracted air
Flux module
Drop-Jet in different sizes
Preheat module
IR heating, convection or combination of IR and convection
Solder module
Electromagnetic solder pot
Mini-wave 13 kg up to 2 pots
