TECHNICAL PARAMETERS:
Programmable phase contour modulation measurement techniques.
Defect Inspection:Volume, area, height, XY offset, shape, etc.
Defect Types:shift, excessive solder, insufficient solder, offset, deformed shape, etc.
Smallest component size: 008004.
Accuracy: XY=10 um,Height = 0.37 um.
Repeatability: height：≤1um （4 Sigma）;volume/acreage：<1%（4 Sigma）.
Maximum Loading PCB Size(X*Y): 480x490mm.
Ultra-high frames and high precision industrial camera.
Linear encoder.
Professional of GPU image processing.
Inspection Speed: 0.35 SEC/FOV.
Fiducial mark Detection Time: 0.3sec/piece.
Maximum inspection height:±450um （±1200umOption）.
High precision industrial camera with high frame count.
RGB Tune patented technology.
D-lighting patented technology.
Dynamic and static warpage compensation.
Barcode function with traceability.
Badmark transfer function of placement machine.
Access IMS system functions.
Operating System Support: Windows 7 Professional (64 bit).
Five-minute programming, one-click operation.
SPC process control.
