TECHNICAL PARAMETERS:
Inspection Principle: Programmable phase contour modulation measurement techniques(PSLM PMP)
Inspection type:Volume, area, height, XY offset, shape, etc.
Defect Types:shift, excessive solder, insufficient solder, offset, deformed shape, etc.
Smallest component: 0402.
Accuracy: XY=10 um,Height = 0.37 um.
Repeatability: height：≤1um （4 Sigma）;volume/acreage：<1%（4 Sigma）.
Maximum Loading PCB Size(X*Y):1200x550mm.
Inspection Speed: 0.35 SEC/FOV.
Fiducial Detection Time: 0.3sec/piece.
Maximum inspection height:±450um（±1200umOption）.
RGB Tune patented technology.
D-lighting patented technology.
Dynamic and static warpage compensation.
Barcode function with traceability.
Closed loop to printers.
Badmark transfer function to mounters.
Access IMS system functions.
Operating System Support: Windows 7 Professional (64 bit).
Five-minute programming, one-click operation.
SPC process control.
