Conventional Type
Apply: 8 Canned solder paste
Shape Size: L620*W320*H480mm
Cabin: 100*110*100mm
Package Size: L680*W360*H520mm
Product Weight: 28KG
Including box weight: 36KG
Solder paste use and requirements:
Before using the solder paste, take out the solder paste from the refrigerator, its temperature will be much lower than room temperature. If the bottle cap is opened without temperature return, it is easy to condense the water vapor in the air and stick to the tin slurry. After printing with this solder paste, when the soldering furnace (temperature exceeds 200℃), water evaporates rapidly due to strong heat, resulting in "tin explosion" phenomenon, resulting in tin beads, and even damage components. In order to match the welding process in production, such as printing performance, anti-collapse performance, demoulding performance, solder paste needs to be recycled before use.
At present, most factories manage the temperature return of solder paste manually: the solder paste to be used is placed on the table at the front of the press, and the temperature return time is recorded manually by the operator. This method is not only inefficient and wastes a lot of production time, but also often occurs when the operator pursues output and uses a solder paste that is not fully reheated. Or because of different operators, make the same kind of a product, sometimes use different temperature return time solder paste, the pros and cons of different welding effect.
There are also operators from the refrigerator to take out the solder paste, immediately stirring, think that after stirring, the temperature is up, and then on the line to use, so that after reflow welding sometimes can not see what impact. The use of no temperature, direct mixing of solder paste may sometimes have no problem, but the comparison of natural temperature mixing and direct mixing of solder paste, there will be differences. Direct stirring can play a certain role in temperature return, but by no means complete. It may look the same to the naked eye, but you can see a lot of bubbles in X-ray, or you can see a lot of difference in a paste that is naturally and gently stirred under a 3D microscope.
Three, the advantages of using solder paste temperature return machine:
After mixing in the blender, the viscosity will change, and the printing will feel no change, so many people think it is ok. However, the temperature return resolves the appropriate temperature of flux activity, and the two are different. Of course, there will be a certain temperature of stirring, but did not reach the required temperature. In addition, when you carefully observe the bubbles of Chip and BGA, you will find that the void rate is different.
1. The use of temperature return function to better solve the problem of natural temperature return, can effectively help control the production plan, improve production efficiency.
2. Only in the production of all aspects of the process are strictly controlled, to ensure the stability of product quality.
