Product name: Bakelite nozzle
Type: Step type
Purpose: The main tool for LED automatic die bonding machine to absorb wafers and IC bare chips.
Specifications are usually: 3mil~40mil
Length is usually: 14mm, 17mm
Nozzle inclination: 60°
Performance: durable, wear-resistant, high temperature resistant, high hardness
Production capacity: about 400~700K
Material classification:
Yellow material (made of German/Swiss yellow material, used for LED)
Brown (made of imported American DuPont brown material, used for semiconductor) [instantaneous high temperature resistance is about 480 degrees]
Packing specifications: 50 pieces/box
