Product name: Ceramic nozzle
Brand: SPT
Purpose: Main tool for LED automatic crystal bonding machine to absorb wafers and IC bare chips
Performance: Durable, wear-resistant, high temperature resistant, high hardness
Ceramic nozzle improves the indentation caused by the high hardness of tungsten steel nozzle when sucking LED wafers and IC bare chips, improves the semiconductor packaging yield, and has obvious improvements on chip dark bounce and IR, making it more convenient and faster to absorb and transport chips, and reducing scratches on chips, and has a long service life and strong durability. It is one of the preferred products for crystal bonding nozzles.
Model: 2102-14-C-CT-008-004 (14*4mil)
The material is ZRO2-3Y (zirconia), producing 6mil~8mil chips.
