Siemens HF3 Pick And Place Machine

HF3 material station: 180

HF3 patch head: 3 X-Y axis cantilevers

HF3 production year: 2004-2006

HF3 placement speed: 40000/H

HF3 placement accuracy: ±60 micron standard, ±55 micron DCA, ±0.7°/(4σ)

PCB thickness 0.3-4.5 mm (requires thicker PCBs)

 

HF3 can be attached to the size of PCB:

In single track: PCB from 50mm x 50mm to 450mm x 508mm;

             50mm x 80mm to 610mm x508mm ("Longboard" option)

 

In double track: PCB from 50 x 50mm to 450mm x 250mm

             50 x 80mm to 610mmx250mm ("Longboard" option)

 

The range of components that HF3 can mount:

   From the smallest 0201 or even 01005 chips all the way to flip chips, CCGAs and odd-shaped components weighing 100 grams and 85 x 85/125 x 10mm in size