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Imaging Method | Dynamic Imaging |
Camera | 4 Mpix |
Imaging Resolution | 10 µm or 15 µm (factory setting) |
Lighting | RGB LED |
3D Technology | 2-way Fringe Pattern |
Field of View |
4 Mpix@ 10 µm: 20 x 20 mm 4 Mpix@ 15 µm: 30 x 30 mm |
Imaging Speed |
4 Mpix@ 10 µm: 90 cm²/sec 4 Mpix@ 15 µm: 200 cm²/sec |
Height Resolution | 0.4 µm |
Max. Solder Height |
@ 10 µm: 600 µm @ 15 µm: 550 µm |
X-Axis Control | Linear Motor and linear scale with DSP-based controller |
Y-Axis Control | Ballscrew + AC-servo controller |
Z-Axis Control | Ballscrew + AC-servo controller |
X-Y Axis Resolution | 0.5 µm |
Z-Axis Resolution | 1 µm |
Max PCB Size |
TR7007 SII Plus: 510 x 460 mm TR7007L SII Plus: 660 x 610 mm TR7007 SII Plus DL: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lane |
PCB Thickness | 0.6-5 mm |
Max PCB Weight | 3 kg |
Top Clearance | 25 mm |
Bottom Clearance | 40 mm |
Edge Clearance | 3 mm |
Conveyor Height |
880 – 920 mm * SMEMA Compatible |
Defects |
Insufficient Paste Excessive Paste Shape Deformity Missing Paste & Bridging |
Measurement |
Height Area Volume Offset |
WxDxH |
TR7007 SII Plus: 1100 x 1570 x 1550 TR7007L SII Plus: 1300 x 1610 x 1560 mm TR7007 SII Plus DL: 1100 x 1770 x 1560 mm Note: not including signal tower, signal tower height 520 mm |
Weight |
TR7007 SII Plus: 950 kg TR7007L SII Plus: 1250 kg TR7007 SII Plus DL: 1100 kg |