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Imaging Method | Dynamic Imaging |
Camera | 4 Mpix |
Imaging Resolution | 10 µm or 15 µm (factory setting) |
Lighting | RGB LED |
3D Technology | 2-way Fringe Pattern |
Field of View |
4 Mpix@ 10 µm: 20 x 20 mm 4 Mpix@ 15 µm: 30 x 30 mm |
Imaging Speed |
4 Mpix@ 10 µm: 80 cm²/sec 4 Mpix@ 15 µm: 180 cm²/sec |
Height Resolution | 0.4 µm |
Max. Solder Height |
@ 10 µm: 600 µm @ 15 µm: 550 µm |
X-Axis Control | Linear Motor and linear scale with DSP-based controller |
Y-Axis Control | Ballscrew + AC-servo controller |
Z-Axis Control | Ballscrew + AC-servo controller |
X-Y Axis Resolution | 0.5 µm |
Z-Axis Resolution | 1 µm |
Max PCB Size |
TR7007 SII: 510 x 460 mm TR7007LL SII: 850 x 610 mm |
PCB Thickness | 0.6-5 mm |
Max PCB Weight |
TR7007 SII: 3 kg TR7007LL SII: 5 kg |
Top Clearance | 40 mm |
Bottom Clearance | 40 mm |
Edge Clearance | 3 mm |
Conveyor Height |
880 – 920 mm * SMEMA Compatible |
Defects |
Insufficient Paste Excessive Paste Shape Deformity Missing Paste & Bridging |
Measurement |
Height Area Volume Offset |
WxDxH |
TR7007 SII: 1220 x 1663 x 1620 TR7007LL SII: 1600 x 1813 x 1637 mm Note: not including signal tower, signal tower height 520 mm |
Weight |
TR7007 SII: 920 kg TR7007LL SII: 1117 kg |