TRI SPI TR7007 SII 3D Solder Paste Inspection

 
Brand Name: TRI
Model: TR7007 SII
Condition: Used

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Offering inspection speeds of up to 180 cm2/sec, the TR7007 SII is the fastest solder paste inspection system in the industry. This highly accurate inline shadow-free solder paste inspection solution offers full 3D inspection at resolutions of 15 µm or 10 µm. Built on a high precision linear motor platform, the system’s hallmark features include closed loop function, enhanced 2D imaging, auto-warp compensation and fringe pattern technology. Increase capacity without sacrificing additional space with an available dual-lane configuration.
 


Optical System

Imaging Method Dynamic Imaging
Camera 4 Mpix
Imaging Resolution 10 µm or 15 µm (factory setting)
Lighting RGB LED
3D Technology 2-way Fringe Pattern
Field of View 4 Mpix@ 10 µm: 20 x 20 mm
4 Mpix@ 15 µm: 30 x 30 mm

Inspection Performance

Imaging Speed 4 Mpix@ 10 µm: 80 cm²/sec
4 Mpix@ 15 µm: 180 cm²/sec
Height Resolution 0.4 µm
Max. Solder Height @ 10 µm: 600 µm
@ 15 µm: 550 µm

Motion Table & Control

X-Axis Control Linear Motor and linear scale with DSP-based controller
Y-Axis Control Ballscrew + AC-servo controller
Z-Axis Control Ballscrew + AC-servo controller
X-Y Axis Resolution 0.5 µm
Z-Axis Resolution 1 µm

Board Handling

Max PCB Size TR7007 SII: 510 x 460 mm
TR7007LL SII: 850 x 610 mm
PCB Thickness 0.6-5 mm
Max PCB Weight TR7007 SII: 3 kg
TR7007LL SII: 5 kg
Top Clearance 40 mm
Bottom Clearance 40 mm
Edge Clearance 3 mm
Conveyor Height 880 – 920 mm

* SMEMA Compatible

Inspection Functions

Defects Insufficient Paste
Excessive Paste
Shape Deformity
Missing Paste & Bridging
Measurement Height
Area
Volume
Offset

Dimensions

WxDxH TR7007 SII: 1220 x 1663 x 1620
TR7007LL SII: 1600 x 1813 x 1637 mm

Note: not including signal tower, signal tower height 520 mm
Weight TR7007 SII: 920 kg
TR7007LL SII: 1117 kg

 
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