TRI SPI TR7007D SII 3D Solder Paste Inspection

 
Brand Name: TRI
Model: TR7007D SII
Condition: Used

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The TR7007D SII is a cutting-edge 3D SPI system designed to enhance your production processes. With its high-speed platform, the 3D SPI delivers up to 50% faster inspection compared to previous models, ensuring optimal efficiency. Experience improved accuracy and stability, allowing for precise solder measurements and minimizing false calls. Equipped with a wide spectrum light system and coaxial lighting*, the TR7007Q SII enhances contrast and detection rates, enabling you to capture intricate details with exceptional clarity. The 3D SPI is an Industry 4.0 Ready Solution supporting the upcoming and innovative protocols such as IPC Connected Factory Exchange (CFX) and IPC Hermes 9852 standard. (*Optional)

Optical System

Imaging Method Stop-and-Go Imaging
Camera 21 Mpix
Imaging Resolution 9.8 μm
Lighting Wide Spectrum 2D Lights (RGB+W), Coaxial Lighting
3D Technology 2-way Digital Fringe Pattern
Field of View 50.30 x 40.24 mm

Inspection Performance

Imaging Speed Up to 2.6 FOV/sec
Height Resolution 0.4 μm
Max. Solder Height 420 μm

* on Calibration Target

Motion Table & Control

X-Axis Control Ballscrew + AC Servo with EtherCAT Motion Controller
Y-Axis Control Ballscrew + AC Servo with EtherCAT Motion Controller
Z-Axis Control Ballscrew + AC Servo with EtherCAT Motion Controller
X-Y Axis Resolution 1 μm
Z-Axis Resolution 1 μm

Board Handling

Max PCB Size 510 x 460 mm
PCB Thickness 0.6 - 5 mm
Max PCB Weight 3kg
Top Clearance 25 mm
Bottom Clearance 40 mm
Edge Clearance 3 mm
Conveyor Height 880 – 920 mm

* SMEMA Compatible

Inspection Functions

Defects Insufficient Paste
Excessive Paste
Shape Deformity
Missing Paste & Bridging
Measurement Height
Area
Volume
Offset

Dimensions

WxDxH 1000 x 1480 x 1650 mm

Note: not including signal tower, signal tower height 515 mm
Weight 795 kg

 
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