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Imaging Method | Stop-and-Go Imaging |
Camera | 21 Mpix |
Imaging Resolution | 9.8 μm |
Lighting | Wide Spectrum 2D Lights (RGB+W), Coaxial Lighting |
3D Technology | 2-way Digital Fringe Pattern |
Field of View | 50.30 x 40.24 mm |
Imaging Speed | Up to 2.6 FOV/sec |
Height Resolution | 0.4 μm |
Max. Solder Height |
420 μm * on Calibration Target |
X-Axis Control | Ballscrew + AC Servo with EtherCAT Motion Controller |
Y-Axis Control | Ballscrew + AC Servo with EtherCAT Motion Controller |
Z-Axis Control | Ballscrew + AC Servo with EtherCAT Motion Controller |
X-Y Axis Resolution | 1 μm |
Z-Axis Resolution | 1 μm |
Max PCB Size | 510 x 460 mm |
PCB Thickness | 0.6 - 5 mm |
Max PCB Weight | 3kg |
Top Clearance | 25 mm |
Bottom Clearance | 40 mm |
Edge Clearance | 3 mm |
Conveyor Height |
880 – 920 mm * SMEMA Compatible |
Defects |
Insufficient Paste Excessive Paste Shape Deformity Missing Paste & Bridging |
Measurement |
Height Area Volume Offset |
WxDxH |
1000 x 1480 x 1650 mm Note: not including signal tower, signal tower height 515 mm |
Weight | 795 kg |