Ersa SMARTFLOW 2020 Selective Soldering Machine Wave Solder

 
PCB width: 15-508 mm
Maximum PCB weight: 3 kg
Mini wave/Mini-Dip
Brand Name: Ersa
Model: SMARTFLOW 2020
Condition: New / Used

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Compact without compromises
Modern process visualisation with ERSASOFT 5
Convenient PC control with swiveling 24'' touch-screen
Ersa CAD-Assistent
Use of Mini-Vario-Wave, Mini-Dip and area nozzles
High ease of servicing
Drop-Jet Fluxer with integrated monitoring
Highest positioning accuracy and process
All-over heating IR preheating lower/upper (scalable)
Low energy and N2 consumption

Ersa SMARTFLOW 2020

Optimum for production in cell manufacturing

With the SMARTFLOW Ersa expands its range of products in this sector by a compact selective soldering system. With a footprint of less than 2.5 sqm the SMARTFLOW perfectly fits in productions with cell manufacturing. The semiautomatic operates in all process steps with the proven Ersa selective soldering technology, just like the larger Ersa VERSAFLOW models, suffering no comprimse in regards to quality and accuracy. The universal pallet mount allows processing boards with the size up to 508 x 508 mm.The fluxer performs with the highest positioning accuracy and with the least amount of flux deposition.

Features like spray jet monitoring or the process monitoring camera provide for process safety. Like the VERSAFLOW model range, the SMARTFLOW is equipped with a all-over preheating. The lower heater is furnished with eight emitters, which can be switched in groups so that the power consumed can be adapted to the heat demand and the size of the board. The upper heater has completely been overtaken from the lower heating is optimally adjusted to it. This ensures an efficient and reproducable through heating even for most complex component like multi-layer or heavy-mass.

Moderne process visualisation with ERSAsoft 5

The SMARTFLOW is the first system to be equipped with the modern ERSAsoft 5 operating software. This new version of our time-tested machine software impresses with its user-oriented structure in addition to modern visualisation. Thanks to individual user interfaces, every user group gets the required data and information at a glance. Another highlight of the software is the picture in picture function (PIP) in combination with the process monitoring camera. Soldering parameters and a live process picture are available at a glance on the 24'' touch-screen, which makes working on the machine ergonomical and clearly arranged.

Dimensions
Length from 1,750 mm
Width from 1,450 mm
Height from 1,520 mm
Conveyor support
Universal pallet mount
PCB width: 15-508 mm
PCB length: 15-508 mm
Maximum PCB top side clearance: 80 mm
Maximum PCB bottom side clearance: 60 mm
Maximum PCB weight: 3 kg
Media supply
Nitrogen
Pneumatic system
Electric supply
Extracted air
Flux module
Drop-Jet in different sizes
Preheat module
IR heating bottom or combination of IR bottom and IR top

Solder module
Electromagnetic solder pot
Mini wave/Mini-Dip (optional)

Options:

Preheat bottom/top side: short-wave, dynamic IR emitters
Emitter control for top and bottom heating
Process monitoring camera (picture in picture system)
Barcode scanner (2D handheld)
Take-over of PCB data from CAD systems; programme creation (CAD assistent)
Automatic soldering wire supply
Different solder nozzle diameters
Nitrogen heating
 
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