1. SMT (Surface Mount Technology): A manufacturing process that involves directly mounting electronic components onto the surface of a PCB.

2. PCB (Printed Circuit Board): A circuit board used to support and connect electronic components.

3. DIP (Dual In-line Package): A common type of electronic component packaging.

4. SMD (Surface Mount Device): Electronic components suitable for SMT processes.

5. BGA (Ball Grid Array): A high-density packaging technology.

6. IC (Integrated Circuit): A device that integrates multiple electronic components onto a single chip.

7. PCB Assembly: The process of mounting electronic components onto a PCB.

8. Reflow Soldering: A soldering process that uses heat to melt solder, connecting electronic components to the PCB.

9. AOI (Automated Optical Inspection): Used to inspect the quality of electronic components and solder joints on a PCB.

10. X-Ray Inspection: Used to inspect the quality of solder joints inside packages such as BGAs.

11. ICT (In-Circuit Test): Functional testing of electronic components on a circuit board.

12. FCT (Functional Test): Functional testing of the entire circuit board or product.

13. THT (Through Hole Technology): A process where the leads of electronic components are inserted through holes in the PCB for soldering.

14. SMT Line: An SMT production line, including equipment such as printing machines, pick-and-place machines, and reflow ovens, used to implement the SMT process.

15. Component Mounting: The process of accurately mounting SMD components onto a PCB.

16. Stencil Printing: A process of printing solder paste onto a PCB using a stencil.

17. Pick and Place: The action of a pick-and-place machine picking up SMD components from a feeder and placing them onto the PCB. 18. Solder Paste: A paste composed of metal powder and flux, used for soldering SMD components.

19. Lead-Free Solder: Environmentally friendly solder that does not contain lead.

20. Wave Soldering: A process where molten solder is applied to the PCB via a wave, used for soldering through-hole components.

21. Cleaning: The process of removing contaminants and flux residues from the circuit board.

22. Quality Control: Ensuring that products meet specified quality standards.

23. Yield: The ratio of acceptable products to the total number of products manufactured.

24. ESD (Electrostatic Discharge): An electrostatic phenomenon that can damage electronic components.

25. Reliability: The ability of a product to function normally under specified conditions.

26. PCB Fabrication: The process of manufacturing PCBs, including design, drilling, etching, etc.

27. Component Lead Forming: Bending the leads of components into a shape suitable for soldering or mounting.

28. Solder Joint: The soldered connection point between an electronic component and the PCB.

29. Void: A bubble or gap in a solder joint, which can affect the quality and reliability of the joint.

30. PCB Thickness: The thickness dimension of the PCB board.

31. Copper Thickness: The thickness of the copper foil on the PCB.

32. Impedance Control: Ensuring impedance matching for signal transmission on the PCB.

33. RF PCB: Radio Frequency PCB, a PCB used for high-frequency signal transmission.

34. Microvia: A via hole on a PCB with a diameter less than 0.15mm.

35. Blind Via: A via hole that only connects internal layers of the PCB.

36. Buried Via: A via hole completely embedded within the PCB. 37. PCB Material: PCB materials, commonly used ones include FR-4 and Rogers.

38. SMT Component Feeder: SMT component feeder, used to supply SMD components to the pick-and-place machine.

39. Nozzle: The nozzle of the pick-and-place machine, used to pick up and place SMD components.

40. Feeder Calibration: Feeder calibration, ensuring accurate feeding of SMD components.

41. Component Placement Accuracy: Component placement accuracy, the positional deviation of components placed by the pick-and-place machine.

42. Reflow Profile: Reflow profile, the curve of temperature change over time in the reflow oven, affecting soldering quality.

43. Solderability: Solderability, the ability of electronic component leads or PCB pads to be soldered.

44. Flux: Flux, a chemical substance used to facilitate soldering.

45. Solder Spatter: Solder spatter, solder particles produced during the soldering process.

46. Tombstoning: Tombstoning, the phenomenon where SMD components stand upright after soldering.

47. Component Shift: Component shift, the deviation of the component position from the designed position after placement.

48. PCB Warpage: PCB warpage, the bending or deformation of the PCB board.

49. SMT Production Line: The overall process of the SMT production line, including printing, placement, reflow soldering, etc.

50. Cycle Time: Cycle time, the time required to complete one production process.

51. SMT Stencil: SMT stencil, a template used for printing solder paste.

52. Adhesive: Adhesive, used to fix the position of SMD components on the PCB.

53. Component Packaging: Component packaging, the appearance and pin arrangement of electronic components.

54. QFN (Quad Flat No-Lead): Quad Flat No-Lead package, a type of surface mount package.

55. SOP (Small Outline Package): Small Outline Package, one of the common integrated circuit packages. 56. SOJ (Small Outline J-lead Package): Small outline J-lead package.

57. PLCC (Plastic Leaded Chip Carrier): Plastic leaded chip carrier package.

58. PGA (Pin Grid Array): Pin grid array package, where pins are arranged in a matrix.

59. COB (Chip-on-Board): Chip-on-board packaging, where the chip is directly mounted on the PCB.

60. Wire Bonding: Wire bonding, a technique for connecting the chip to the PCB or packaging substrate.

61. Flip Chip: Flip chip, where the active side of the chip is connected face down to the PCB or substrate.

62. Underfill: Underfill, used to fill the gap between the chip and the PCB to enhance reliability.

63. PCB Design: including layout, routing, signal integrity, etc.

64. Gerber File: a graphic file format required for PCB manufacturing.

65. DFM (Design for Manufacturing):  a PCB design method that considers manufacturing processes.

66. NPI (New Product Introduction): the process of introducing a new product into production.

67. BOM (Bill of Materials):  a list of raw materials and components required for a product.

68. MOQ (Minimum Order Quantity): the minimum purchase quantity required by the supplier.

69. JIT (Just-in-Time): Just-in-time production, producing and supplying components just in time according to actual demand.

70. Kanban: a signaling system used to control the production process.

71. Cost of Goods Sold: the direct costs incurred in producing a product.

72. ROI (Return on Investment): a metric for measuring investment efficiency.

73. ERP (Enterprise Resource Planning): a system that integrates enterprise management information.

74. MES (Manufacturing Execution System): software that monitors and manages the production process in real time. 75. Six Sigma: A quality management methodology aimed at reducing defects and improving process stability.

 

These terms are only a portion of those used in the electronics manufacturing industry; specific terminology may vary depending on the industry, company, and product.