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Inspection Principle: Programmable phase contour modulation measurement techniques(PSLM PMP)
Inspection type:Volume, area, height, XY offset, shape, etc.
Defect Types:shift, excessive solder, insufficient solder, offset, deformed shape
D-lighting patented technology.
Dynamic copying function and static anti-warping function.
Barcode function with traceability .
Badmark function with mounters.
Closed loop function with printer
Access MES system functions.
Operating System Support: Windows 7 Professional (64 bit).
Five-minute programming, one-click operation.
RGB Tune patented technology.
Smallest component size: 008004.
XY positioning accuracy:1um Grating ruler.
Repeatability: height:≤1um (4 Sigma);volume/acreage:<1%(4 Sigma).
Maximum Loading PCB Size(X*Y): 450x450mm.
Inspection Speed: 0.3 SEC/FOV.
Fiducial mark Detection Time: 0.5sec/piece.
Maximum inspection component height:±550um (±1200umOption).
High precision industrial camera with high frame count.