SinicTek 3D SPI Ultra SPI Solder Paste Inspection Machine

TECHNICAL PARAMETERS:

Programmable phase contour modulation measurement techniques.

Defect Inspection:Volume, area, height, XY offset, shape, etc.

Defect Types:shift, excessive solder, insufficient solder, offset, deformed shape, etc.

Smallest component size: 008004.

Accuracy: XY=10 um,Height = 0.37 um.

Repeatability: height：≤1um （4 Sigma）;volume/acreage：<1%（4 Sigma）.

Maximum Loading PCB Size(X*Y): 480x490mm.

Ultra-high frames and high precision industrial camera.

Linear encoder.

Professional of GPU image processing.

Inspection Speed: 0.35 SEC/FOV.

Fiducial mark Detection Time: 0.3sec/piece.

Maximum inspection height:±450um （±1200umOption）.

High precision industrial camera with high frame count.

RGB Tune patented technology.

D-lighting patented technology.

Dynamic and static warpage compensation.

Barcode function with traceability.

Badmark transfer function of placement machine.

Access IMS system functions.

Operating System Support: Windows 7 Professional (64 bit).

Five-minute programming, one-click operation.

SPC process control.