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TECHNICAL PARAMETERS:
Inspection Principle: Programmable phase contour modulation measurement techniques(PSLM PMP)
Inspection type:Volume, area, height, XY offset, shape, etc.
Defect Types:shift, excessive solder, insufficient solder, offset, deformed shape, etc.
Smallest component size: 01005.
Accuracy: XY=10 um,Height = 0.37 um.
Repeatability: height:≤1um (4 Sigma);volume/acreage:<1%(4 Sigma).
Maximum Loading PCB Size(X*Y): 470x470mm.
Inspection Speed: 0.42 SEC/FOV.
Fiducial Detection Time: 0.3sec/piece.
Maximum detection height:±450um(±1200umOption).
RGB Tune patented technology.
D-lighting patented technology.
Barcode function with traceability.
Badmark transfer function to mounters.
Access IMS system functions.
Operating System Support: Windows 7 Professional (64 bit).
Five-minute programming, one-click operation.
SPC process control.