FUJI XPF-L SMT Pick And Place Machine SMT XPF Chip Mounter

• Special feature

1.1 Placing heads ("auto-tools") are exchanged automatically during production:The XPF is the world's first machine to feature dynamic head exchange.The machine can switch between a high-speed placing head and a multi-purpose head automatically during production to ensure that the most efficient head for the current task is being used.This includes the ability to switch to a glue head, meaning that glue application and part placement can be performed at the same machine.

1.2 No need to decide between a high-speed mounter or multi-purpose machine:Because head exchange is dynamic and automatic, the XPF is a borderless solution, covering high-speed and multi-purpose needs at the same time.Whatever the type of panel, the XPF achieves the optimal balance of production capability, ensuring that you always get the most out of your equipment.

1.3 Support for panels up to 686 x 508 mm with the XPF-W:The XPF-W model is designed to handle large and heavy-duty panels with dimensions up to 686 x 508 (27 x 20 inches) mm and weighing up to 6 kg.

• Specifications

• Machine Specifications		Revolver Auto-tool	Single Nozzle	M4 Auto-tool	Glue Auto-tool
  Number of nozzles		12	1	4	Number of syringes loaded : 1 syringe per glue station
  Number of auto-tools held in auto-tool station		2 (XPF-L) / 3 (XPF-W)	6 (XPF-L) / 8 (XPF-W) (One Tray Height Measurement Auto-tool is held when using trays)	1	Number of feeder slots occupied: 8 (MFU-40) (Fixed loading position - up to 4 glue auto-tools can be loaded)
  Supported parts		0402(01005) to 20 x 20 mm 　Maximum height: 3.0 mm	1005(0402) to 45 x 150 (68 x 68) mm Maximum height: 25.4 mm	4 nozzles type: 3 x 3 to 14 x 14 mm 2 nozzles type: 14 x 14 to 22 x 26 mm Maximum height: 6.5 mm	Loading side: Side 1 (MFU-40 or fixed device)
  Machine tact	XPF-L	0.144 sec / component 25,000 cph	0.400 sec / component 9,000 cph	4 nozzles type: 0.343 sec/ shot 10,500 cph 2 nozzles type: 0.456 sec/ shot 7,900 cph	Dispense tact: 0.2 sec/shot
  	XPF-W	0.145 sec / component 24,800 cph	0.418 sec / component 8,600 cph	4 nozzles type; 0.351 sec/ shot 10,250 cph 2 nozzles type; 0.462 sec/ shot 7,800 cph
  Placing accuracy	Small chip parts	+/-0.050 mm cpk≥1.00 +/-0.066 mm cpk≥1.33	+/-0.040 mm cpk≥1.00 +/-0.053 mm cpk≥1.33	-	Dispense position accuracy: +/-0.1 mm cpk≥1.00
  	QFP parts	+/-0.040 mm cpk≥1.00 +/-0.053 mm cpk≥1.33	+/-0.030 mm cpk≥1.00 +/-0.040 mm cpk≥1.33	+/-0.040 mm cpk≥1.00 +/-0.053 mm cpk≥1.33
  PCB size (LXW)		Up to 457 x 356 mm Thickness 0.4 (0.3) to 5.0 mm (XPF-L) / 686 x 508 mm Thickness 0.4 to 6.5 mm (XPF-W)Min 50 x 50 mm
  PCB loading time		1.8 sec (XPF-L) / 3.5 sec (XPF-W)
  Machine dimensions	XPF-L	L: 1,500 mm, W: 1,607.5 mm, H: 1,419.5 mm (Conveyance height: 900 mm H: excludes signal tower)
  	XPF-W	L: 1,500 mm, W: 1,762.5mm, H: 1,422.5mm (Conveyance height: 900 mm H: excludes signal tower)
  Machine weight		Machine body XPF-L: 1,500 kg / XPF-W: 1,860 kg MFU-40: Approx. 240 kg (with W8 feeders loaded) BTU-AII: Approx. 120 kg, BTU-B: Approx. 15 kg, MTU-AII: Approx. 615 kg (with trays/feeders loaded)

   

  Parts Packaging

  Tape parts (JIS standard, JEITA), stick parts, tray parts

   

  Options

  Stick Feeder, Wide Fiducial Camera, Dip Flux Unit, Reel Set Stand (within the main machine), Lead Coplanarity Check, Custom Nozzles and Mechanical Chucks, Fujitrax