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Yamaha YV100XG Chip Mounter Automatic Used Pick and Place Machine
Mounting Speed:16200CPH
Board size M type: L460*W335
Total weight 1600KG
Dimensions 1650*1408*1900
Board size M type: L460*W335
Total weight 1600KG
Dimensions 1650*1408*1900
Brand Name:
YAMAHA
Model:
YV100XG
Condition:
Used
Payment Methods
Yamaha YV100XG Chip Mounter
1) High-speed and high-precision multi-functional modular chip mounter machine
2) 0.18 seconds/CHIP ultra high speed placement (best condition) 16200CPH (grain/hour)
3) In the IPC9850 state, the patch speed is up to 16200CPH (corresponding to 0.22 seconds/CHIP)
4) Mount 0603 components, the whole precision up to ± 50 microns, full repeat accuracy up to ± 30 microns
5) Wide range of applications, from 0201 (inch) microcomponents to 31mm QFP large components
6) Using 2 high resolution multi-vision digital cameras
7) Continuous solder ball recognition for CSP/BGA components, including the determination of the defect of solder balls
8) The YAMAHA patented flight change nozzle can be selected, which can effectively reduce the machine idle loss
9) The best choice for universal type
10) The Y-axis is driven by high-power servo amplifiers and high-rigidity screw rods at the left and right ends.
This newly developed fully-fixed dual-driver technology accelerates acceleration and co-ordination
through both ends to drive and completes the acceleration function. Reduced positioning time.
Board size M type: L460*W335(MAX)-L50*W50(MIN)
L type: L460*W440(MAX)-L50*W50(MIN)
Mounting Accuracy Absolute Accuracy (μ+3σ): ±0.05mmip, ±0.05mm/QFP
Mounting speed 0.18 seconds/CHIP 1.7 seconds/QFP,1608/CHIP:16200CPH
Mountable Components 0603-31mm Components, SOP/SOJ/QFP/Connectors/PLCC/CSP/BGA
Dimensions 1650*1408*1900
Total weight 1600KG
1) High-speed and high-precision multi-functional modular chip mounter machine
2) 0.18 seconds/CHIP ultra high speed placement (best condition) 16200CPH (grain/hour)
3) In the IPC9850 state, the patch speed is up to 16200CPH (corresponding to 0.22 seconds/CHIP)
4) Mount 0603 components, the whole precision up to ± 50 microns, full repeat accuracy up to ± 30 microns
5) Wide range of applications, from 0201 (inch) microcomponents to 31mm QFP large components
6) Using 2 high resolution multi-vision digital cameras
7) Continuous solder ball recognition for CSP/BGA components, including the determination of the defect of solder balls
8) The YAMAHA patented flight change nozzle can be selected, which can effectively reduce the machine idle loss
9) The best choice for universal type
10) The Y-axis is driven by high-power servo amplifiers and high-rigidity screw rods at the left and right ends.
This newly developed fully-fixed dual-driver technology accelerates acceleration and co-ordination
through both ends to drive and completes the acceleration function. Reduced positioning time.
Board size M type: L460*W335(MAX)-L50*W50(MIN)
L type: L460*W440(MAX)-L50*W50(MIN)
Mounting Accuracy Absolute Accuracy (μ+3σ): ±0.05mmip, ±0.05mm/QFP
Mounting speed 0.18 seconds/CHIP 1.7 seconds/QFP,1608/CHIP:16200CPH
Mountable Components 0603-31mm Components, SOP/SOJ/QFP/Connectors/PLCC/CSP/BGA
Dimensions 1650*1408*1900
Total weight 1600KG
Yamaha yv100xg is the multifunctional Pick and Place Machine.
That is fully automatic which is easier for every person to operate by getting simple guidance. No matter what is the nature of your business, the important feature of the machine is that it is perfect for every business.
It is suitable for all types of industrial applications including electronics, automotive, electrical manufacturing, and many others.
The Refurbished yamaha yv100xg pick and place machine comes with multiple sizes only for the best cause of our customers. The latest technology is applied to the model YV100Xg.
Ensure your ordered products are always safely packaged fast delivery to your hands
