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Imaging Method | Dynamic Imaging or Stop-and-Go on select configurations |
Top Camera | 4 or 9 or 12 Mpix high speed color camera (factory setting) |
Angle Camera | N/A |
Imaging Resolution | 6 µm, 10 µm, 15 µm (factory setting) |
Lighting | Multi-phase RGB+W LED |
3D Technology | N/A |
Max. 3D Range | N/A |
Imaging Speed |
4 Mpix@ 10 µm Dynamic Imaging: 60 cm²/sec 4 Mpix@ 15 µm Dynamic Imaging: 120 cm²/sec 9 Mpix@ 10 µm Dynamic Imaging: 72 cm²/sec 12 Mpix@ 6 µm Dynamic Imaging: 40 cm²/sec 4 Mpix@ 10 µm Stop-and-Go: 4.5 FOV/sec 4 Mpix@ 15 µm Stop-and-Go: 4.5 FOV/sec |
X-Axis Control | Ballscrew + AC-servo controller |
Y-Axis Control | Ballscrew + AC-servo controller |
Z-Axis Control | N/A |
X-Y Axis Resolution | 1 µm |
Max PCB Size |
TR7700 SII Plus@ 10 µm, 15 µm: 510 x 460 mm TR7700 SII Plus@ 6 µm: 400 x 400 mm TR7700 SII Plus DL@ 10 µm, 15 µm: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lane TR7700 SII Plus DL@ 6 µm: 400 x 310 mm x 2 lanes, 400 x 400 mm x 1 lane |
PCB Thickness | 0.6-5 mm |
Max PCB Weight | 3 kg |
Top Clearance |
10 µm, 15 µm: 25 mm [48 mm optional◎※] 6 µm: 25 mm ◎The air blow module does not apply to this option ※This option is only available for 4 Mpix camera. |
Bottom Clearance |
10 µm, 15 µm: 40 mm [100 mm optional] 6 µm: 40 mm |
Edge Clearance | 3 mm [5 mm optional] |
Conveyor |
Inline Height: 880 – 920 mm * SMEMA Compatible |
Component |
Missing Tombstoning Billboarding Polarity Rotation Shift Wrong Marking (OCV) Defective Upside Down Extra Component Foreign Material |
Solder |
Excess Solder Insufficient Solder Bridging Through-hole Pins Lifted Lead Golden Finger Scratch/Contamination |
WxDxH |
TR7700 SII Plus: 1000 x 1400 x 1650 mm TR7700 SII Plus DL: 1000 x 1500 x 1650 mm Note: not including signal tower, signal tower height 520 mm |
Weight |
TR7700 SII Plus: 600 kg TR7700 SII Plus DL: 650 kg |