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TRI AOI TR7700 SIII 3D Automated Optical Inspection
    • TRI AOI TR7700 SIII 3D Automated Optical Inspection

    TRI AOI TR7700 SIII 3D Automated Optical Inspection

     
    Brand Name: TRI
    Model: TR7700 SIII
    Condition: Used

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    Specification
    TRI's ground breaking 3D AOI solution delivers the fastest hybrid PCB inspection combining optical and blue-laser-based true 3D profile measurement for the highest automated defect symptom coverage possible. Integrated state-of-the-art software solution and third generation intelligent hardware platform offer stable and robust 3D solder and component defect inspection and with high inspection coverage and easy programming.

    Optical System

    Imaging Method Dynamic Imaging with true 3D profile measurement
    Top Camera 4 Mpix
    Angle Camera N/A
    Imaging Resolution 10 µm, 15 µm (factory setting)
    Lighting Multi-phase RGB+W LED
    3D Technology Single/Dual 3D laser sensors
    Max. 3D Range 20 mm

    Inspection Performance

    Imaging Speed 4 Mpix@ 10 µm 2D: 60 cm²/sec
    4 Mpix@ 15 µm 2D: 120 cm²/sec
    4 Mpix@ 10 µm 2D+3D: 27-39 cm²/sec*
    4 Mpix@ 15 µm 2D+3D: 40-60 cm²/sec*

    * Depending on board size and laser resolution

    Motion Table & Control

    X-Axis Control Ballscrew + AC-servo controller
    Y-Axis Control Ballscrew + AC-servo controller
    Z-Axis Control N/A
    X-Y Axis Resolution 1 µm

    Board Handling

    Max PCB Size TR7700 SIII 3D: 510 x 460 mm
    TR7700L SIII 3D: 660 x 460 mm
    TR7700 SIII 3D DL: 510 x 250 mm x 2 lanes, 510 x 550 mm x 1 lane
    PCB Thickness 0.6-5 mm
    Max PCB Weight 3 kg
    Top Clearance 25 mm
    Bottom Clearance 40 mm
    Edge Clearance 3 mm [5 mm optional]
    Conveyor Inline
    Height: 880 – 920 mm

    * SMEMA Compatible

    Inspection Functions

    Component Missing
    Tombstoning
    Billboarding
    Polarity
    Rotation
    Shift
    Wrong Marking (OCV)
    Defective
    Upside Down
    Extra Component
    Foreign Material
    Lifted Component
    Solder Excess Solder
    Insufficient Solder
    Bridging
    Through-hole Pins
    Lifted Lead
    Golden Finger
    Scratch/Contamination

    Dimensions

    WxDxH TR7700 SIII 3D: 1100 x 1670 x 1550 mm
    TR7700L SIII 3D: 1300 x 1630 x 1655 mm
    TR7700 SIII 3D DL: 1100 x 1770 x 1550 mm

    Note: not including signal tower, signal tower height 520 mm
    Weight TR7700 SIII 3D: 1030 kg
    TR7700L SIII 3D: 1250 kg
    TR7700 SIII 3D DL: 1150 kg

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