TRI SPI TR7007D 3D Solder Paste Inspection

TR7007D

Highly Accurate stop-and-go 3D SPI solution with latest TRI dual digital projector shadow-free technology and inspection route optimization for enhanced inspection performance. Easy programming with innovative software bring maximum value to your production line.

 

Perfect Accuracy with Optimized Performance

TR7007D employs TRI’s latest 3D projector technology combined with advanced scanning path optimization to achieve best available inspection accuracy while maintaining competitive inspection speed.

 

Stable and Reliable Performance

Fully optimized for maximum stability, the TR7007D delivers reliable inspection results 24 hours every day. Innovative SmartWarp technology automatically compensates for local board warpage and local fiducial marks help eliminate any impact of manufacturing tolerances.

 

Unique Low Bridge Inspection

World’s first inspection of low solder paste bridges under 30 μm ensures no printing defects are missed, and guarantees accurate results under any conditions.

 

Easy Automated Programming

Rapid automated 5-step programming interface ensures fast changeovers, minimal idle time and helps reduce operator work load.

 

Shadow Free Inspection Technology

Dual digital projector design and intelligent software ensure the TR7007D delivers completely shadow-free inspection results and eliminates problems with specular reflections.

 

Multi-Color Vision for any PCB

Multi-phase color lighting guarantees accurate inspection results on any PCB color and finish combination, without sacrificing inspection speed.