IC red glue PS-810 PS-820 green glue blue glue hypoxia yellow glue PS-830 red glue PS-850

red glue green glue
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Part Number: PS-810 PS-820 PS-830 PS-850 PS-860 SCT-965

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Product name: IC red glue, green glue (blue glue) for bonding
Packing specifications:
PS-810: slow-drying red glue 200g/bottle
PS-820: fast-drying red glue 250g/bottle
PS-830: fast-drying yellow glue 250g/bottle
PS-850: fast-drying red glue 250g/bottle
PS-860: fast-drying blue glue/green glue 250g/bottle
SCT-965: fast-drying blue glue/green glue 250g/bottle
Content: High-strength bonding glue, resistant to oil, water and other fluids after curing.
Use: Suitable for chip (IC) bonding and other metal bonding. Curing has anti-vibration and anti-corrosion functions, and can also act as a lubricant when the machine is running. Bonding time: Taking a 3mm*3mm IC chip as an example, at room temperature of 25℃, after about 5-25 minutes of bonding, its bonding force can withstand the impact requirements generated during bonding. (Except for joints that are not completely smooth)
Flow rate: 4530CPS﹫20℃ SP3
Pushing force: 18N/mm(2)
Temperature range: -80℃ to +150℃
Application instructions: All joint surfaces must be clean and free of grease. The joint effect begins when all air in the joint is removed and the gap is less than 0.5mm. For details, please refer to the application technical indicators of anoxic glue.
Limitations: It cannot be applied to greasy and oily surfaces. When using, the user should check whether the material is appropriate at the time and adjust the amount appropriately. Do not use too much glue and expose it around the chip, otherwise it will affect the joint effect. Please pay attention to your eyes when applying and keep away from children.
Storage: Please store in a dry and cool place at 5-20℃. The validity period is half a year at 23℃.

 
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