What craft edge? Although the process edge is not the real element that constitutes the printed circuit board (PCB), it plays a very important role for the PCB assembled by surface mount technology (SMT). As the name suggests, the function

Nowadays, it is more and more convenient for engineers to make SMT patches. However, as an engineer, do you really understand the various processes in SMT?

1. Reasons for the production of tin beads (part one): Phenomenon: Tin balls are generally one or a few large solder balls, which usually appear next to chip resistors or capacitors, or around the pins of fine-pitch chips. Analysis: excessi

The tombstone phenomenon often occurs in the reflow soldering process of CHIP components (such as chip capacitors and chip resistors). The smaller the component, the more likely it is. Especially in the production of 1005 SMD components, it

reflow oven temperature curve & time value